MB SD Connect Compact 5 Star Diagnosis For Cars And Trucks
Newest Update V2019 MB SD Connect Star C5 Software HDD With DTS Monaco & Vediamo Software
MB SD Connect 5 Highlights:
- Supported Multi-Language: English/Bulgarian/Danish/Greek/Spanish/French/Italian/Korean/Polish/Romanuan/Serbo-Croatian/ Turkish/Czech/German/Finish/Hyngarian/Japanese/Dutch/Portuguese/Russian/Swedish/Chinese.
- Support Wireless And Lan Cable Connection.
- UDS Chip. K Line And CAN BUS Protocol, Also UDS Protocol.
- One MB SD C5 Diagnostic Tool Support Mercedes Benz Cars And Trucks After Year 2000.
The New MB Compact 5 Features:
- New MB SD Connect Compact 5 Star Diagnosis Support Wireless Diagnose;
- New MB SD Connect Compact 5 Star Diagnosis Not Only Support K Line Diagnose And CAN BUS,But Also UDS Diagnose Protocol. Because Old MB STAR C4 Main Board Do Not Have UDS Chip, So Old MB STAR C4 Can Not Support It;
- Multiplexer Now Use Lan Cable To Connect
- Connector Adopt Military Quick Swap Technology, It Can Support 10,000 Times Pull Plug, More Stable;
- All Core Accosseries Adopt Original New Packing Chip, And 24hours Test, Guarantee The Quality Of The Products;
SD Connect C5 Supported System:
ENGINE, Automatic Transmission, Air Conditioning System, SRS, ABS And ASR, MPL, GM, Benz Original Security DASX System, KEYZESS GO System And OBD II System, Etc.
MB SD Connect C5 Test Function:
Read The Fault Code, Clear Fault Codes, Dynamic Data Flow, Computer Programming Matching, Personalized Settings, Component Test And Maintenance Of Information Consultation, Component Location Map, The Circuit Diagram.
DAS: Selfdiagnosis System With Concise Interface, Clear Operation Method, Makes The Query Failure, The Major Detection System Is So Agile And Accurate.
MB SD Connect Compact 5 Supported Vehicle List:
Support Mercedes Benz Cars After Year 2000
Passenger Car Support List:
A(176), A(169), A(168), B(246), B(245), CLC(117), C(204) C(203), C(202), 190(201), E(212), E(211), E(210), 124(124), S(222), S(221), S(220), S(140), S(126),
E(207), CLK(209), CLK(208), CLS(218), CLS(219), CL(216), CL(215), CL(140) SLK(172), SLK(171), SLK(170), SL(231), SL(230), SL(129), SL(107), SLS(197),
M(166), M(164), M(163), G(463), G(461), E(212), E(211), E(210), 124(124), S(222), S(221),S(220), S(140), CLK(209), CLK(208), CLS(218), CLS(219), CL(216),
CL(215), CL(140), SLK(172), SL(231), SL(230), SL(129), SL(107),SLS(197), M(166), M(164), M(163), G(460), GL(164), GLK(204), R(251)
Van Support List:
MB 100(631), T1, SprinterIII, SprinterII, SprinterI, Sprinter900, Citan, Vito(639), Vito(638), V(638), Viano(639), T2, Vario, Vaneo(414)
Truck Support List:
Actros963/4, Actros2,3, AtegoIII, AtegoII, AxorII, Eonic, Zetros, Actros, Atego Light, Atego Heavey, HPN M96, Atron, HPN M2000, SKL, FSK.
Unimog Support List:
U20, UGN, UHN
Bus Support List:
TRAVEGO, INTOURO, INTEGRO, CITARO, CAPACITY, CITO, TOURISMO, O350/O403, CONECTO, O404, O405-O408,
Minibus, OC500, TOURO, TOURINO, MBC, MULITEGO, O500, O500/OH, OH, OH368, OF, OF384, LO, O400,
Super Sports Car Support List:
SLR(199)
I. The Software Of MB SD Connect 5 And MB SD Connect 4 Is Same.
II. The Hardware Of MB SD C5 Is Better And More Stable.
- The Host Communication Connection End USES From Design, To Avoid Inadvertently Fall In The Normal Use Of The Communication Port To Connect And Communication Failure, Etc.
- DC 12 V Power Supply Design/Host Upgrades To Avoid The Battery Installation/Battery Voltage Instability/Host Can’t Enter The Shutdown State, Etc, Caused By The Motherboard And Rapid Aging Of The Battery.
- The Host CPU Radiator Surface And Perfectly Fit Alloy Shell, Good Heat Dissipation Effect. Equipment Running Smoothly, Don’t Crash.
- The Host USES The Tamper Clasp, Should To Avoid Fragile Warranty Sticker Damage Caused By The Warranty Disputes.
- Host Wi-Fi Protected The Upgrade For PC Plastic Shell, Solid Quality Does Not Affect The Wi-Fi Signal.
- OBD Main Telecommunication Lines Connected To The Host End Upgraded To VGA15 Industrial-Grade Connector.
- Network Upgrade For Gigabit Connections/Pure Copper Wire Core/Double Layer Aluminum Foil/Woven Mesh/Silica Insulation Material. Gigabit Communication Against Interference/Pulling Open Circuit / / Fracture In Low Temperature.